Hana Micron Inc
KOSDAQ:067310
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P/OCF
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Valuation Scenarios
If P/OCF returns to its 3-Year Average (13.5), the stock would be worth ₩24 050 (31% downside from current price).
| Scenario | P/OCF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 19.5 | ₩34 650 |
0%
|
| 3-Year Average | 13.5 | ₩24 050 |
-31%
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| 5-Year Average | 8.2 | ₩14 632.81 |
-58%
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| Industry Average | 18.3 | ₩32 460.63 |
-6%
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| Country Average | 9 | ₩15 955.39 |
-54%
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Forward P/OCF
Today’s price vs future operating cash flow
Peer Comparison
| Market Cap | P/OCF | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
H
|
Hana Micron Inc
KOSDAQ:067310
|
2.3T KRW | 19.5 | 106.5 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.8T USD | 46.9 | 40.2 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
1.9T USD | 63.6 | 75.6 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
54.1T TWD | 23 | 28 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
515.8B USD | 16.8 | 21.4 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 14.6 | 18.2 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
453.6B USD | 58.8 | 104.6 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
342.1B USD | 35.3 | -1 281.2 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
202.4B USD | 28.3 | 40.7 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
172.7B USD | 34.2 | 63.8 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
172.4B USD | 113.3 | 215.2 |
Market Distribution
| Min | 0.2 |
| 30th Percentile | 4.2 |
| Median | 9 |
| 70th Percentile | 16.6 |
| Max | 2 215 132.4 |
Other Multiples
Hana Micron Inc
Glance View
Hana Micron, Inc. engages in the provision of semiconductor packaging products and testing services. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2005-10-11. The firm provides flip chip ball grid array (FCBGA) packaging, wafer level chip-scale packaging (WLCSP), system in package, multi chip packaging, quad flat no lead (QFN) packaging and others, which are applied in communication equipment, mobile phones, personal digital assistant (PDA) devices, digital cameras, digital video discs (DVDs), moving picture experts group audio layer three (MP3) players, digital televisions (TVs) and others. The firm also provides universal serial bus (USB) flash drives. The firm distributes its products within domestic market and to overseas markets.
