Hana Micron Inc
KOSDAQ:067310
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Western Digital Corp
NASDAQ:WDC
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US |
P/E
Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.
Price to Earnings (P/E) ratio shows how much investors pay for each dollar of a company`s earnings. It`s calculated by dividing the company`s market value by its total earnings.
Valuation Scenarios
If P/E returns to its Industry Average (17.2), the stock would be worth ₩9 870.77 (73% downside from current price).
| Scenario | P/E Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 62.8 | ₩36 050 |
0%
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| Industry Average | 17.2 | ₩9 870.77 |
-73%
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| Country Average | 13.9 | ₩7 957.8 |
-78%
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Forward P/E
Today’s price vs future net income
| Today's Market Cap | Net Income | Forward P/E | ||
|---|---|---|---|---|
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₩2.4T
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/ |
Jan 2026
₩38.1B
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= |
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₩2.4T
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/ |
Dec 2026
₩105.6B
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= |
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₩2.4T
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/ |
Dec 2027
₩160B
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= |
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Forward P/E shows whether today’s P/E still looks high or low once future net income are taken into account.
Peer Comparison
| Market Cap | P/E | ||||
|---|---|---|---|---|---|
| KR |
H
|
Hana Micron Inc
KOSDAQ:067310
|
2.4T KRW | 62.8 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
4.9T USD | 40.8 | |
| US |
|
Broadcom Inc
NASDAQ:AVGO
|
1.9T USD | 77.1 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
52.6T TWD | 27.9 | |
| US |
|
Micron Technology Inc
NASDAQ:MU
|
513.3B USD | 21.3 | |
| KR |
|
SK Hynix Inc
KRX:000660
|
701.7T KRW | 18.2 | |
| US |
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
453.8B USD | 104.7 | |
| US |
|
Intel Corp
NASDAQ:INTC
|
342.1B USD | -1 281.2 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
208.4B USD | 41.9 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
181.3B USD | 67 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
177.1B USD | 221.1 |
Market Distribution
| Min | 0.2 |
| 30th Percentile | 8.5 |
| Median | 13.9 |
| 70th Percentile | 23.4 |
| Max | 7 223 |
Other Multiples
Hana Micron Inc
Glance View
Hana Micron, Inc. engages in the provision of semiconductor packaging products and testing services. The company is headquartered in Asan, Chungcheongnam-Do. The company went IPO on 2005-10-11. The firm provides flip chip ball grid array (FCBGA) packaging, wafer level chip-scale packaging (WLCSP), system in package, multi chip packaging, quad flat no lead (QFN) packaging and others, which are applied in communication equipment, mobile phones, personal digital assistant (PDA) devices, digital cameras, digital video discs (DVDs), moving picture experts group audio layer three (MP3) players, digital televisions (TVs) and others. The firm also provides universal serial bus (USB) flash drives. The firm distributes its products within domestic market and to overseas markets.