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Kulicke and Soffa Industries Inc
XMUN:KU1

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Kulicke and Soffa Industries Inc
XMUN:KU1
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Price: 90.25 EUR -0.55% Market Closed
Market Cap: €7.8B

Kulicke and Soffa Industries Inc
Investor Relations

Kulicke and Soffa Industries makes equipment used to package semiconductors and other electronic components. Its machines help connect tiny chips to the leads and circuits that let them work inside phones, computers, cars, and many other devices. The company also sells related tools and consumable parts used with that equipment. Its main customers are chipmakers, semiconductor packaging companies, and electronics manufacturers that need specialized production tools. Kulicke and Soffa earns money by selling the equipment itself, plus replacement parts, upgrades, and service support after the sale. That mix matters because these tools are expensive, highly technical, and often require ongoing maintenance and process support. What makes the business different is its role near the end of the semiconductor manufacturing chain. Instead of making chips, it helps turn finished chips into usable packaged components. That puts the company in a niche but essential position: when electronics makers need reliable chip packaging, they rely on equipment like Kulicke and Soffa's to do the precise assembly work.

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Last Earnings Call
Fiscal Period
Q2 2026
Call Date
May 7, 2026
AI Summary
Q2 2026

Demand: Kulicke & Soffa said demand improved faster than expected, with customer sentiment strong and utilization still above average across its biggest markets.

Revenue: March-quarter revenue rose 21.5% sequentially, and management said the company delivered above prior expectations and above guidance.

Outlook: The company guided June-quarter revenue to $310 million, up 28% sequentially, and said fiscal Q4 could rise another 5% to 10% sequentially.

TCB Growth: Fluxless Thermo-Compression remains the main growth driver, with management saying TCB revenue should grow at least 70% sequentially this fiscal year and top $100 million.

Investment: The company is expanding Advanced Solutions capacity to support about $400 million of revenue, with $20 million of capex planned and production expansion targeted for the first half of fiscal 2027.

Mix Shift: Strength came from general semiconductor, memory, and automotive/industrial demand, while APS softened because refurbished system sales were lower.

R&D Focus: Management highlighted ongoing investment in hybrid bonding, panel-level architecture, vertical wire, and new power and memory solutions.

Key Financials
Revenue
$310 million
Revenue
21.5% sequential growth
General semiconductor revenue
$148.9 million
Memory shipments
$31.3 million
Gross margin
49.3%
Earnings per share
$0.66
Earnings per share
$0.79
Operating expenses
$81.1 million
Operating expenses
$73.8 million
Tax expense
$7.4 million
TCB revenue
over $100 million
Advanced Solutions capacity
about $400 million of revenue
Capital expenditures
$20 million
Capital expenditures
$12 million
Fiscal fourth quarter revenue growth
5% to 10% sequentially
China utilization
around 92%
Earnings Call Recording
Other Earnings Calls

Management

Dr. Fusen Ernie Chen Ph.D.
President, CEO & Director
No Bio Available
Mr. Lester A. Wong J.D.
Executive VP of Finance & IT and CFO
No Bio Available
Mr. Robert Nestor Chylak
Senior VP of Central Engineering & CTO
No Bio Available
Mr. Mun Pun Wong
Senior Vice President of Global Sales & Supply Chain
No Bio Available
Mr. Chan Pin Chong
Executive VP and GM of K&S Products & Solutions
No Bio Available
Mr. Joseph Elgindy
Senior Director of Investor Relations & Strategic Planning
No Bio Available
Mr. Zi Yao Lim
Director of Legal Affairs, Interim General Counsel & Corporate Secretary
No Bio Available
Ms. Lisa Lim
Vice President of Global Human Resources
No Bio Available

Contacts

Address
23A Serangoon North Avenue 5, #01-01 K&S Corporate Headquarters
Contacts
+6568809600.0
www.kns.com
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