ChipMOS Technologies Inc
TWSE:8150
Decide at what price you'd be comfortable buying and we'll help you stay ready.
|
Bunzl plc
LSE:BNZL
|
UK |
ChipMOS Technologies Inc
Note Receivable
ChipMOS Technologies Inc
Note Receivable Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Note Receivable | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
C
|
ChipMOS Technologies Inc
TWSE:8150
|
Note Receivable
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Note Receivable
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Note Receivable
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
United Microelectronics Corp
TWSE:2303
|
Note Receivable
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
MediaTek Inc
TWSE:2454
|
Note Receivable
NT$7m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Nanya Technology Corp
TWSE:2408
|
Note Receivable
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
ChipMOS Technologies Inc
Glance View
ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. The company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
