ChipMOS Technologies Inc
TWSE:8150
Decide at what price you'd be comfortable buying and we'll help you stay ready.
|
Johnson & Johnson
NYSE:JNJ
|
US |
|
Berkshire Hathaway Inc
NYSE:BRK.A
|
US |
|
Bank of America Corp
NYSE:BAC
|
US |
|
Mastercard Inc
NYSE:MA
|
US |
|
UnitedHealth Group Inc
NYSE:UNH
|
US |
|
Exxon Mobil Corp
NYSE:XOM
|
US |
|
Pfizer Inc
NYSE:PFE
|
US |
|
Nike Inc
NYSE:NKE
|
US |
|
Visa Inc
NYSE:V
|
US |
|
Alibaba Group Holding Ltd
NYSE:BABA
|
CN |
|
JPMorgan Chase & Co
NYSE:JPM
|
US |
|
Coca-Cola Co
NYSE:KO
|
US |
|
Verizon Communications Inc
NYSE:VZ
|
US |
|
Chevron Corp
NYSE:CVX
|
US |
|
Walt Disney Co
NYSE:DIS
|
US |
|
PayPal Holdings Inc
NASDAQ:PYPL
|
US |
ChipMOS Technologies Inc
Goodwill
ChipMOS Technologies Inc
Goodwill Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Goodwill | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
C
|
ChipMOS Technologies Inc
TWSE:8150
|
Goodwill
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Goodwill
NT$51.9B
|
CAGR 3-Years
0%
|
CAGR 5-Years
0%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Goodwill
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
United Microelectronics Corp
TWSE:2303
|
Goodwill
NT$27.2m
|
CAGR 3-Years
53%
|
CAGR 5-Years
29%
|
CAGR 10-Years
6%
|
|
|
MediaTek Inc
TWSE:2454
|
Goodwill
NT$68.1B
|
CAGR 3-Years
1%
|
CAGR 5-Years
1%
|
CAGR 10-Years
1%
|
|
|
Nanya Technology Corp
TWSE:2408
|
Goodwill
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
ChipMOS Technologies Inc
Glance View
ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. The company is headquartered in Baoshan, Hsinchu. The company went IPO on 2013-04-19. The firm mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. The company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.