Wah Lee Industrial Corp
TWSE:3010
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Wah Lee Industrial Corp
Treasury Stock
Wah Lee Industrial Corp
Treasury Stock Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Treasury Stock | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
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Wah Lee Industrial Corp
TWSE:3010
|
Treasury Stock
N/A
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CAGR 3-Years
N/A
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CAGR 5-Years
N/A
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CAGR 10-Years
N/A
|
|
|
S
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Supreme Electronics Co Ltd
TWSE:8112
|
Treasury Stock
-NT$112.2m
|
CAGR 3-Years
0%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
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WPG Holdings Ltd
TWSE:3702
|
Treasury Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Synnex Technology International Corp
TWSE:2347
|
Treasury Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
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WT Microelectronics Co Ltd
TWSE:3036
|
Treasury Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
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Scientech Corp
TWSE:3583
|
Treasury Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
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Wah Lee Industrial Corp
Glance View
Wah Lee Industrial Corp. engages in the business of manufacturing and selling materials and equipment for semiconductor processing and communication. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2000-09-19. The firm conducts its businesses through five segments. The Information Technology (IT)/Information Architecture (IA) segment provides plastic products for computers, electronic connectors, optical products and others. The Semiconductor segment provides silicon chips, as well as chemicals and special gases used for the manufacture of integrated circuits (ICs). The Flat Panel Display (FPD) segment provides back light modules, diffuser boards, IC wafers, liquid crystal modules (LCMs), desiccants and others. The Printed Circuit Board (PCB)/Motherboard (MB) segment provides equipment and consumable materials for PCBs, carriers and other products. The Optoelectronics and Green Energy segment provides solar cell module materials, as well as light emitting diode (LED) processing and packaging materials.