ChipMOS Technologies Inc
F:CPIA
Decide at what price you'd be comfortable buying and we'll help you stay ready.
|
C
|
ChipMOS Technologies Inc
F:CPIA
|
TW |
|
C
|
ConvaTec Group PLC
OTC:CNVVY
|
UK |
|
L
|
Lindsay Corp
F:LMF
|
US |
|
Takashimaya Co Ltd
F:TKM
|
JP |
|
A
|
Amtech Systems Inc
XBER:AS3
|
US |
|
C
|
Consolidated Water Co Ltd
F:CW2
|
KY |
|
Longfor Group Holdings Ltd
HKEX:960
|
CN |
|
P
|
Phillips 66
XETRA:R66
|
US |
|
B
|
Bank of Montreal
SWB:BZZ
|
CA |
|
C
|
Consolidated Edison Inc
LSE:0I35
|
US |
|
D
|
DBV Technologies SA
XMUN:DBV
|
FR |
|
Bausch + Lomb Corp
NYSE:BLCO
|
CA |
|
H
|
HSBC Holdings PLC
BMV:HBCN
|
UK |
|
U
|
United Parcel Service Inc
XBER:UPAB
|
US |
|
M
|
Madrigal Pharmaceuticals Inc
SWB:YDO1
|
US |
|
B
|
Balchem Corp
XBER:BL9B
|
US |
|
Wipro Ltd
NSE:WIPRO
|
IN |
|
E
|
Entergy Corp
LSE:0IHP
|
US |
|
Caixabank SA
OTC:CAIXY
|
ES |
ChipMOS Technologies Inc
ChipMOS Technologies is a semiconductor back-end services company. It does not design chips; it assembles, tests, and packages integrated circuits so they can be sold and used in electronics. Its main work includes wafer probing, final testing, packaging, and related handling for chips such as memory devices, display driver ICs, and other logic chips. Its customers are semiconductor designers and chip makers that need a manufacturing partner for the last steps of the chip-production chain. ChipMOS earns money by charging fees for these outsourced services, so its business depends on the amount and mix of chips that customers send for assembly and testing. Because this work is a necessary step before chips reach device makers, ChipMOS sits in an important middle position between chip design and end-market electronics production. What makes ChipMOS different is that it is a specialized manufacturing service company rather than a chip designer or a finished-goods brand. It sells technical process capacity, equipment, and quality control rather than a product people use directly. That makes it a key behind-the-scenes supplier for the semiconductor industry, especially in areas where chips need precise testing and careful packaging before shipment.
ChipMOS Technologies is a semiconductor back-end services company. It does not design chips; it assembles, tests, and packages integrated circuits so they can be sold and used in electronics. Its main work includes wafer probing, final testing, packaging, and related handling for chips such as memory devices, display driver ICs, and other logic chips.
Its customers are semiconductor designers and chip makers that need a manufacturing partner for the last steps of the chip-production chain. ChipMOS earns money by charging fees for these outsourced services, so its business depends on the amount and mix of chips that customers send for assembly and testing. Because this work is a necessary step before chips reach device makers, ChipMOS sits in an important middle position between chip design and end-market electronics production.
What makes ChipMOS different is that it is a specialized manufacturing service company rather than a chip designer or a finished-goods brand. It sells technical process capacity, equipment, and quality control rather than a product people use directly. That makes it a key behind-the-scenes supplier for the semiconductor industry, especially in areas where chips need precise testing and careful packaging before shipment.
Revenue Growth: Q2 2025 revenue increased 3.7% sequentially to TWD 5,736 million, driven by strong memory product demand despite weakness in auto and industrial sectors.
Gross Margin Decline: Gross margin fell to 6.6%, down 280 basis points quarter-over-quarter, largely due to DDIC ASP cuts, higher electricity costs, and NTD appreciation.
Net Loss: The company reported a net loss of TWD 533 million (TWD 0.75 per share), mainly from significant foreign exchange loss (TWD 690 million).
Memory Strength: Memory product revenue jumped 21.2% QoQ and is expected to outperform DDIC in Q3 due to favorable supply/demand and price increases.
Q3 Outlook: Management expects continued strength in memory and improving conditions for OLED and auto panels, with memory OSAT price hikes of 5–18% to offset cost inflation.
CapEx Discipline: CapEx remains conservative, targeted at high-growth, higher-margin areas, while preserving a strong balance sheet.
Dividend Policy: No change in dividend policy is planned for 2026; management expects stable payouts supported by retained earnings.